Liquid crystal display device

ABSTRACT

A liquid crystal display device includes an annular seal located between a first substrate and a second substrate, and a liquid crystal layer sealed in a space surrounded by the first substrate, the second substrate, and the annular seal. The first substrate includes a first metal layer, a first insulating layer covering the first metal layer, a second metal layer formed on the first insulating layer, a second insulating layer covering the second metal layer, a third metal layer formed on the second insulating layer, a third insulating layer covering the third metal layer, an alignment layer arranged on the third insulating layer, and a display region where a plurality of pixels are formed. At least one recessed groove is formed in the third insulating layer and is located at a region between the display region and the annular seal.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a bypass continuation of international patentapplication PCT/JP2014/002478, filed: May 9, 2014 designating the UnitedStates of America, the entire disclosure of which is incorporated hereinby reference.

TECHNICAL FIELD

The present disclosure relates to a liquid crystal display device.

BACKGROUND

When an orientation film material for controlling a direction(orientation) of liquid crystal molecules is spread on a surface of asubstrate included in a liquid crystal display and reaches a regionbetween a sealing material for sealing a liquid crystal material and thesurface of the substrate, an adhesiveness between the surface of thesubstrate and the sealing material is deteriorated, thus giving rise toa drawback that a liquid crystal material may leak.

Prior arts disclose a technology that suppresses the spreading bywetting of an orientation film with recessed grooves which are formedinside a region where the sealing material is arranged and outside thedisplay region by etching a second insulating layer covering a secondconductive layer including a plurality of video signal lines, or byetching a first insulating layer covering a first conductive layerincluding a plurality of scanning signal lines and the second insulatinglayer (See Japanese unexamined published patent application Nos.2008-26345 and 2007-322627)

In the technology disclosed in the prior arts, because the firstconductive layer and the second conductive layer are exposed at a bottomarea of the recessed grooves, transparent conductive material includedin a conductive layer is formed inside the recessed grooves. However, itis difficult to arrange the recessed grooves in a region which overlapsa plurality of wirings made of the first conductive layer and the secondconductive layer, because a voltage inside the recessed grooves iscommon with the transparent conductive material. In other words, in thistechnology, the region where the recessed grooves are arranged islimited by an arrangement of wirings made of the first conductive layerand the second conductive layer.

SUMMARY

An object of present disclosure is to provide a liquid crystal displaydevice which suppresses the spreading by wetting of an orientation filmfrom reaching a region where the sealing material is formed, withoutbeing limited by an arrangement of wirings made of the first conductivelayer including scanning single lines and the second conductive layerincluding video signal lines.

In one general aspect, the instant application describes a liquidcrystal display device including a first substrate, a second substrateopposed to the first substrate, an annular seal located between thefirst substrate and the second substrate, and a liquid crystal layersealed in a space surrounded by the first substrate, the secondsubstrate, and the annular seal. The first substrate includes a firstmetal layer including a plurality of scanning signal lines, a firstinsulating layer covering the first metal layer, a second metal layerincluding a plurality of video signal lines, the second metal beingformed on the first insulating layer, a second insulating layer coveringthe second metal layer, a third metal layer including a plurality ofcommon lines, the third metal being formed on the second insulatinglayer, a third insulating layer covering the third metal layer, analignment layer arranged on the third insulating layer, the alignmentlayer contacting to the liquid crystal layer, and a display region wherea plurality of pixels are formed, one pixel is defined by two of theplurality of scanning signal lines and two of the plurality of videosignal lines. At least one recessed groove is formed in the thirdinsulating layer and is located at a region between the display regionand the annular seal.

The above general aspect may include one or more of the followingfeatures. The at least one recessed groove may be a continuous groovecompletely surrounding the display region in the plan view and extendingacross each of the plurality of video signal lines and the plurality ofscanning signal lines.

The at least one recessed groove may be a plurality of recessed groovesincluding a first recessed groove completely surrounding the displayregion and a second recessed groove completely surrounding the displayregion. The first recessed groove may be closer to the display regionthan the second recessed groove in the region between the display regionand the annular seal.

The at least one recessed groove may be a plurality of arrays ofrecessed grooves including a first array of recessed grooves and asecond array of recessed grooves. The first array of recessed groovesmay include a plurality of recessed grooves arranged around the displayregion in the plan view, each adjacent pair of the plurality of recessedgrooves of the first array being separated by a space. The second arrayof recessed grooves may include a plurality of recessed grooves arrangedaround the display region in the plan view, each adjacent pair of theplurality of recessed grooves of the second array being separated by aspace. Each of the spaces between the recessed grooves of the firstarray is adjacent to one of the recessed grooves of the second array inthe plan view. The first array of recessed grooves is closer to thedisplay area than the second array of recessed grooves in the regionbetween the display region and the annular seal in the plan view.

The liquid crystal display device may further include an organicinsulating layer formed between the second insulating layer and thethird insulating layer. The at least one recessed groove may be formedin the third insulating layer and the organic insulating layer.

At least one opening may be formed in the organic insulating layerbetween the display region and the at least one recessed groove. The atleast one opening may has a length extending in a direction from thedisplay region to the at least one recessed groove that is greater thana width of the at least one opening that is orthogonal to the direction.

The liquid crystal display device may further include a plurality ofpixel electrodes formed between the second insulating film and the thirdinsulating film. The at least one recessed groove may be covered by atransparent conductive film. The transparent conductive film is a samelayer with the plurality of pixel electrodes.

Apart of one of the plurality of scanning signal lines may be branchedinto a plurality branched wirings. The at least one opening overlaps theplurality of branched wirings in plan view.

In the configuration of the display device of the present disclosure,the liquid crystal display device is able to suppress the spreading bywetting of an orientation film from reaching the region where thesealing material is formed, without limitation of the arrangement ofwirings made of the first conductive layer and the second conductivelayer, because the bottom area of the recessed grooves is positioned onor above the second insulting layer which covers the second conductivelayer.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic plan view showing a constitution of a liquidcrystal display panel of a first embodiment;

FIG. 2 is a schematic cross-sectional view of a part of a displayregion;

FIG. 3 is a schematic enlarged view of the region A shown in FIG. 1;

FIG. 4 is a schematic enlarged view of the region B shown in FIG. 3;

FIG. 5 is a schematic enlarged view of the region C shown in FIG. 3;

FIG. 6A is a schematic cross-sectional view taken along a line VIa-VIain FIG. 4;

FIG. 6B is a schematic cross-sectional view taken along a line VIb-VIbin FIG. 5;

FIG. 7 is a schematic cross-sectional view taken along a line VII-VII inFIG. 4;

FIG. 8 is a schematic cross-sectional view taken along a line VIII-VIIIin FIG. 4;

FIG. 9 is another schematic cross-sectional view taken along a lineIX-IX in FIG. 5;

FIG. 10A is another schematic cross-sectional view taken along a lineVIa-VIa in FIG. 4;

FIG. 10B is another schematic cross-sectional view taken along a lineVIb-VIb in FIG. 5;

FIG. 11A is another schematic cross-sectional view taken along a lineVIa-VIa in FIG. 4;

FIG. 11B is another schematic cross-sectional view taken along a lineVIb-VIb in FIG. 5;

FIG. 12A is another schematic cross-sectional view taken along a lineVIa-VIa in FIG. 4;

FIG. 12B is another schematic cross-sectional view taken along a lineVIb-VIb in FIG. 5; and

FIG. 13 is a schematic plan view showing the schematic constitution of aliquid crystal display panel of another embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, an exemplary embodiment of the present disclosure will bedescribed with reference to the drawings. Here, in all drawings forexplaining the embodiments, parts having identical functions are giventhe same symbol and their repeated explanation is omitted.

First Embodiment

FIG. 1 is a schematic plan view showing a schematic constitution of aliquid crystal display device of the first embodiment. The liquidcrystal display device 1 according to the present embodiment is,so-called an IPS mode, a transverse electric field drive mode liquidcrystal display device which includes a first substrate and a secondsubstrate opposed to each other. The first substrate SUB1 is mainlyreferred to as a TFT substrate where wirings and TFT elements (not shownin FIG. 1) are arranged on a surface of a transparent electrode which ismade of a glass or the like. The second substrate SUB2 is mainlyreferred to as a color filter substrate where a red (R) color filter, agreen (G) color filter and a blue (B) color filter (not shown in FIG. 1)are arranged on a surface of a transparent electrode which is made of aglass and so on. An annular sealing material is arranged between thefirst substrate SUB1 and the second substrate SUB2, and a liquid crystalmaterial (not shown in FIG. 1) is sealed in a space surrounded by thefirst substrates SUB1, the second substrate SUB2 and a seal SL formed bythe annular sealing material. Here, a display region DA for displayingan image is formed in a region surrounded by the seal SL.

In the display region DA, for example, a plurality of scanning signallines GL and a plurality of common lines CL which extend in the xdirection and a plurality of video signal lines DL which extend in the ydirection are formed (not shown in FIG. 1). Each scanning signal line GLis connected to a scanning sign driver (not shown) arranged outside ofthe display region DA at a side edge of the first substrate SUB1parallel with the y direction. Each video signal line DL is connected toa video sign driver (not shown) arranged outside of the display regionDA at a side edge of the first substrate SUB1 parallel with the xdirection. A region surrounded by two neighboring scanning signal linesGL and two neighboring video signal lines DL corresponds to one pixelwhich is a unit for forming an image, and a TFT element, a pixelelectrode and a common electrode are formed in each pixel (not shown inFIG. 1).

Next, a cross-sectional structure on the first substrate SUB1 will bedescribed. FIG. 2 is a schematic cross-sectional view of a part of adisplay region DA in the first substrate SUB1. As illustrated in FIG. 2,the scanning signal line GL is formed on a transparent substrate TSUB.The scanning signal line GL is included in a first metal layer M1 formedby a metal, such as copper, on the transparent substrate TSUB. Thescanning signal line GL is formed by etching the first metal layer M1with a known technique of photolithography.

A first insulting film PAST is formed overlapping the first metal layerM1 and is made of silicon nitride or the like. The video signal line DL(not shown in FIG. 2) is formed on the first insulating layer PAS1. Thevideo signal line DL is included in a second metal layer M2 formed by ametal such as copper, on the transparent substrate TSUB. The videosignal line DL is formed by etching the second metal layer M2 with aknown technique of photolithography.

The second metal layer M2 includes a drain electrode SD1 and a sourceelectrode SD2 of a TFT element 2. Then, a semiconductor SCN whichfunctions as channel of the TFT element 2 is arranged in contact withthe drain electrode SD1 and the source electrode SD2. Here, thesemiconductor layers SC are made of amorphous silicon (a-Si), forexample.

A second insulating layer PAS2 made of silicon nitride or the like isarranged on and overlaps the second metal layer M2 and the semiconductorSCN. On the second insulating layer PAS2, a common electrode CT isformed. The common electrode CT is included in a first transparentelectrode T1 made of a transparent conductive material, ITO or the like.The common electrode CT is formed by etching the first transparentelectrode T1 with a known technique of photolithography.

A common line CL is formed in contact with the common electrode CT. Thecommon line CL is included in a third metal layer M3 made of a metal,such as copper or the like, and is arranged over the second insulatinglayer PAS2. The common lines CL are formed by etching the third metallayer M3 with a known technique of photolithography. As illustrated inFIG. 2, an organic insulating layer OPAS which is made of an acrylicresin may be laminated to cover the second insulating layer PAS2.

A third insulating layer PAS3 made of silicon nitride or the like isarranged on and covers the first transparent conductive layer T1 and thethird metal layer M3. On the third insulating layer PAS3, a pixelelectrode PX is formed. The pixel electrode PX is included in a secondtransparent electrode T2 made of a transparent conductive material, ITOor the like. The pixel electrode PX is formed by etching the secondtransparent electrode T2 with a known technique of photolithography. Athrough hole TH is formed in a part of a region where the pixelelectrode PX and the source electrode SD2 overlap, and the pixelelectrode PX and the source electrode SD2 are connected with each otherthrough layers therebetween. Also, slits are formed in a part of thepixel electrode which is opposed to the common electrodes (not shown).

An alignment layer AL is arranged on the second transparent electrode T2and the third insulating layer PAS3. The alignment layer AL is arrangedon an interface with the liquid crystal material, and has a function ofaligning liquid crystal molecules. The alignment layer AL is made of aresin layer, for example, polyimide or the like.

The alignment layer AL is formed in the display region DA and a marginalregion in a peripheral of the display region DA on a surface of thesecond transparent conductive layer T2 and the third insulating layerPAS3 by printing a resin material in a liquid form using an inkjetprinting method, and applying rubbing treatment to the surface. Theinkjet printing method has an advantage of low contamination and thelike due to a non-contact process, but a viscosity of the material forthe inkjet printing method is unlikely to be so high that the materialmay be spread by wetting from the printed area toward a sealing regionwhere a seal SL is arranged.

A recessed groove GT is provided at the first substrate SUB1 forsuppressing the spreading by wetting of the alignment layer material.The recessed groove will be described in reference with figures asfollows.

FIG. 3 is a schematic enlarged view of the region A shown by a dashedline of the first substrate SUB1 in FIG. 1. FIGS. 4 and 5 are schematicenlarged views of the regions B and C shown by dashed lines in FIG. 3,respectively. As illustrated in these figures, the recessed grooves GTare formed along the seal SL between the display region DA and the sealSL of the first substrate SUB1. According to the first embodiment, twoarrays of recessed grooves GT are formed along the seal SL at differentlocations from the display region DA towards the seal SL. The recessedgrooves GT are formed overlapping the scanning signal lines GL which areincluded in the first metal layer M1 and the video signal lines DL whichare included in the second metal layer M2. Also, the recessed grooves GTmay be positioned closer to the seal SL than oblique line portions ofthe scanning signal lines GL and the video signal lines DL. The obliqueline portions of the scanning signal lines GL and the video signal linesDL are portions of the scanning signal lines GL and the video signallines DL which extend obliquely with respect to the x direction and they direction outside of the display region DA, because the scanningsignal lines GL and the video signal lines DL are bound and connected toa plurality of scanning signal drivers (not shown) and video signaldrivers (not shown) disposed outside the seal SL.

FIG. 6A is a schematic cross-sectional view taken along a line VIa-VIain FIG. 4, and FIG. 6B is a schematic cross-sectional view taken along aline VIb-VIb in FIG. 5. These figures illustrate cross-sectional viewsof the recessed grooves GT. As illustrated in FIGS. 6A and 6B, therecessed grooves GT are formed by etching parts of third insulatinglayer PAS3 and the depth of the recessed grooves GT corresponds to athickness of removed third insulating layer PAS3. Bottom areas of therecessed grooves GT are positioned on an upper area of the organicinsulating layer OPAS, and are beyond the second insulating layer PAS2.A transparent conductive material TM which is included in the secondtransparent electrode layer T2 is formed at an inner area and aperiphery of the recessed grooves GT. The third insulating layer PAS3 isremoved by etching the third insulating layer PAS3 with the knowntechnique of photolithography. Here, the third insulating layer PAS3 ismade of an inorganic material such as silicon nitride. On the otherhand, the organic insulating layer OPAS is made of an organic materialsuch as acrylic resin or the like. Therefore, the third insulating layerPAS3 and the organic insulating layer OPAS can be etched independently.

An alignment layer material which is spread from the display region DAtoward the seal SL is trapped inside these recessed grooves GT. Therecessed grooves GT can prevent spreading by wetting of the alignmentlayer material from reaching the region where the seal SL is arranged.Thus, they can lead to a reduced distance between the display region DAand the seal SL, and a small bezel can be realized. In FIGS. 6A and 6B,the alignment layer AL is formed in covering the third insulating layerPAS3 and these recessed grooves GT.

An ITO made transparent conductive material TM formed in and around therecessed grooves GT has a rough surface and low wettablility for thealignment layer material, whereby spreading by wetting the alignmentlayer material can be further suppressed.

Because the bottom areas of the recessed grooves GT are positioned atthe same layer as or over the second insulating layer PAS2, the recessedgrooves GT can be designed irrespective of wirings which are included inthe first metal layer M1 and the second metal layer M2.

By the way, an even thickness of the alignment layer material isrequired inside the display region DA to provide a quality image. Inother words, the spreading by wetting of the alignment layer material issuppressed from reaching the sealing region where the seal SL isarranged. On the other hand, the alignment layer material is preferablyspread between the display region DA and the recessed grooves GT withoutany retaining.

An area between the recessed grooves GT and the display region DA in thefirst substrate SUB1 will be described as follows. As illustrated inFIGS. 4 and 5, some openings PIT1 to PIT3 (each indicated by a dashedline) are formed in a surface of the third insulating layer PAS3 betweenthe display region DA and the recessed grooves GT.

These openings PIT 1 to PIT3 are formed beyond holes by which theorganic insulating layer OPAS is partially removed.

Openings PIT1 are formed between neighboring scanning signal lines GL inand overlapping the common voltage supply line CBL in plan view which isincluded in the second metal layer M2. FIG. 7 is a schematiccross-sectional view taken along a line VII-VII in FIG. 4 andcorresponds to a cross-sectional view of the opening PIT1. According toFIGS. 4 to 7, inside the openings PIT1, the common voltage supply lineCBL is connected through layers therebetween with common line CL, whichis included in the third metal layer M3, with the interlayer connectingcomponent CM, which is included in the second transparent electrodelayer T2. Here, because the organic insulating layer OPAS is thickerthan the other insulating layers, when through holes TH are formed inthe organic insulating layer OPAS, the formation of the interlayerconnecting component CM is difficult. Thus, as described above, theorganic insulating layer OPAS is removed in a position where the throughhole TH is formed.

Openings PIT2 are formed around positions where the scanning signallines GL and the common voltage supply lines CBL cross in plan view.FIG. 8 is a schematic cross-sectional view taken along a line VIII-VIIIin FIG. 4 and corresponds to a cross-sectional view of the openingsPIT2. According to FIGS. 4 to 8, branch wirings BR of the scanningsignal lines GL are arranged inside the openings PIT2 in plan view.

Here, the branch wirings BR will be described. The branch wirings BR areformed by branching of the scanning signal lines GL. The branch wiringsBR are arranged around points where the scanning signal lines GL and thecommon voltage supply lines CBL cross. The scanning signal lines GLincluded in the first metal layer M1 and the common voltage supply lineCBL included in the second metal layer M2 are insulated by the firstinsulating layer PAST, but they may become short-circuited for somereason. The branch wirings BR are designed to repair a short circuitwhich has occurred.

For example, in branch wirings BR illustrated in FIG. 8, when a branchwiring BR is short-circuited with the common voltage supply line CBL,the short-circuited branch wiring BR is cut. The short-circuited branchwiring BR can be detached by cutting the branch wiring BR at two pointson opposite sides of a point where the common voltage supply line CBLcrosses the branch wiring BR. This detaching process is conducted bylaser irradiating the branch wiring BR from a side of the thirdinsulating layer PAS3. Here, the organic insulating layer OPAS has beenremoved at a position which the laser is irradiated so as to prevent theirradiated laser from scattering due to the organic insulating layer OPAwhich is thicker than the other insulating layers.

An opening PIT3 is formed at every video signal line DL between thedisplay region DA and the oblique line portions of the video signallines DL. FIG. 9 is a schematic cross-sectional view taken along a lineIX-IX in FIG. 5 and corresponds to a cross-sectional view of the openingPIT3. According to FIGS. 5 to 9, an electrostatic protection circuit PDis formed within the opening PIT3 to prevent excess current fromentering into the display region DA. The electrostatic protectioncircuit PD is made of both the first metal layer M1 and the second metallayer M2, and includes a portion which connects between the first metallayer M1 and the second metal layer M2 by the interlayer connectingcomponent CM included in the second transparent electrode layer T2.Thus, even when the electrostatic protection circuit PD is disposed, theorganic insulating layer OPAS is removed, similar to locations whereconnections occur between the common voltage supply line CB and thecommon line CL through layers therebetween.

As illustrated in FIGS. 4 and 5, a length of each opening PIT 1 to PIT3in a direction from the display region DA to the seal SL in plan view isgreater than that in a direction in which the seal SL extends. In otherwords, openings PIT 1 to PIT3 are arranged in a manner that theirlength-wise directions are arranged along a direction of spreading ofthe alignment layer material. Therefore, openings PIT 1 to PIT3 whichare arranged between the display region DA and the recessed grooves GTare able to suppress the alignment layer material from being detainedbetween the display region DA and the recessed grooves GT withoutimpeding spreading the alignment layer material. Therefore, thealignment layer material can be spread evenly in the area between thedisplay region DA and the recessed grooves GT and a thickness of thealignment layer material is even inside the display region DA, therebyimproving the image quality.

According to the first embodiment, although it illustrates a case wheretwo arrays of recessed grooves GT are formed along the seal SL indifferent locations from the display region DA towards the seal SL, thenumber of arrays of the recessed grooves GT may be one or more than two.The recessed groove GT may be formed surrounding annularly the displayregion DA and may be formed partially between the display region DA andthe seal SL.

FIGS. 10A-12B are other schematic cross-sectional views taken along aline VIa-VIa and a line VIb-VIb in FIGS. 4 and 5 and correspond to otherconfigurations of the recessed grooves GT.

As illustrated in FIGS. 10A and 10B, the recessed grooves GT are formedon the groove bottom member BM included in the third metal layer M3. Astep is created by a thickness of the groove bottom member BM. This stepcan suppress the alignment layer material from spreading by wetting.With this, the effect of suppressing the alignment layer material fromspreading by wetting can be enhanced. Also, the groove bottom member BMfunctions as a bottom area of the recessed grooves GT, and it can play arole of shielding an electric field created by current flowing in thescanning signal line GL or the video signal line DL by arranging thegroove bottom member BM beyond the scanning signal lines GL and thevideo signal lines DL.

As examples illustrated in FIGS. 11A and 11B, the recessed grooves GTare constituted by holes which are formed by removing a part of theorganic insulating layer OPAS. The recessed grooves GT are formed bylaminating the third insulating layer PAS3 after etching the organicinsulating layer OPAS with a known technique of photolithography. Adepth of the recessed groove GT corresponds to a thickness of theremoved organic insulating layer OPAS. In general, because the organicinsulating layer OPAS is thicker than the third insulating layer PAS3,the depth of the recessed groove GT in this example is deeper than thatof a recessed groove formed by removing a part of only the thirdinsulating layer PAS3. Thus, the effect of suppressing the spreading bywetting of the alignment layer material can be enhanced.

As examples illustrated in FIGS. 12A and 12B, although the organicinsulating layer OPAS is not formed between the third insulating layerPAS3 and the second insulating layer PAS2, recessed grooves GT areformed beyond the groove bottom member BM which is included in the thirdmetal layer M3. Thus, etching the third insulating layer PAS3 in orderto form the recessed grooves GT does not affect the second insulatinglayer PAS2. Further, similar to the examples illustrated in FIGS. 10Aand 10B, a step is formed on a surface of the third insulating layerPAS3, thereby enhancing the effect of suppressing the spreading bywetting of the alignment layer material.

Second Embodiment

FIG. 13 is a schematic plan view showing a constitution of a liquidcrystal display panel of another embodiment. For convenience, thecomponents having the same function as that of the first exemplaryembodiment are designated by the same reference mark, and theirdescription is omitted.

According to the second embodiment, plural arrays of recessed grooves GTare arranged along the seal SL in different locations from the displayregion DA towards the seal SL. In this embodiment, two arrays ofrecessed grooves GT will be described, but the number of arrays is notlimited to two, and it may be more than two.

For convenience, in FIG. 13, an array of recessed grooves GT which islocated closer to the display region DA is called an inner groove array,and an array of recessed grooves GT which is located closer to the sealSL is called an outer groove array. As illustrated in FIG. 13, in a viewfrom the display region DA toward the seal SL, recessed grooves GT ofthe outer groove array are arranged between adjacent recessed grooves GTof the inner groove array. Each recessed groove GT is arranged in amanner that a space between two adjacent recessed grooves of the innergroove array does not overlap a space between two adjacent recessedgrooves of the outer groove array in a view from the display region DA.A length in a direction of the seal SL of each recessed groove GT of theouter groove array is longer than a length in the same direction of thespace between two adjacent recessed grooves of the inner groove array.In other words, the recessed grooves GT of the inner groove array andthe recessed grooves GT of the outer groove array are arranged in amanner that each of the recessed grooves GT of the inner groove arrayand each of recessed grooves GT of the outer groove array overlap witheach other in a view from the display region DA toward the seal SL.

An alignment layer material which reaches an area where the recessedgrooves GT are formed may be trapped in the recessed grooves GT or maybe spread by wetting toward a further outer area by going around therecessed grooves GT. Therefore, a path of the alignment layer materialwhich is spread by wetting between the recessed grooves GT toward thefurther outer area turns in an x or y direction multiple times by thisarrangement of the recessed grooves GT according to the secondembodiment. Thereby, a speed of the spreading by wetting of thealignment layer material is slowed, and then the spreading by wetting ofthe alignment layer material is able to be suppressed. As an overlappingportion between the recessed grooves GT of the inner groove array andthe recessed grooves GT of the outer groove array is longer, a distancein the direction of the seal SL which the alignment layer material flowsis longer. Thereby, the spreading by wetting of the alignment layermaterial is able to be further suppressed. Because a cross sectionalstructure in the recessed groove GT according the second embodiment issimilar with that in the first embodiment, this description is omitted.

As illustrated in FIG. 13, common voltage supply line CBL for providinga common voltage is included in the third metal layer M3, so the commonline CL and the common voltage supply line CBL are formed continuouslyin the third metal layer M3. Thereby, openings for connecting throughlayers between the common line CL and the common voltage supply line CBLare not required in the third insulating layer PAS3. In comparison withan example where openings are formed, a surface of the third insulatinglayer PAS3 is move even between the display region DA and the recessedgrooves GT, which further suppresses the alignment layer material fromspreading.

Although exemplary embodiments of the present disclosure are describedabove, the present disclosure is not limited to these exemplaryembodiments. It is noted that other embodiments properly changed fromthe exemplary embodiments described above by those skilled in the artwithout departing from the scope of the present disclosure are fullysupported by the present disclosure.

For example, in the example of removing a part of organic insulatinglayer OPAS, the third insulating layer PAS3 may also be removed when therecessed grooves GT are formed. It may make depths of recessed groovesGT deeper. With this, the effect of suppressing the spreading of wettingof the alignment layer material can be further enhanced.

1-8. (canceled)
 9. A liquid crystal display device comprising: a firstsubstrate; a second substrate opposed to the first substrate; an annularseal located between the first substrate and the second substrate; and aliquid crystal layer sealed in a space surrounded by the firstsubstrate, the second substrate, and the annular seal, wherein the firstsubstrate comprising: a first metal layer including a plurality ofscanning signal lines; a first insulating layer covering the first metallayer; a second metal layer including a plurality of video signal lines,the second metal layer being formed on the first insulating layer; asecond insulating layer covering the second metal layer; a third metallayer including a plurality of common lines, the third metal beingformed on the second insulating layer; a third insulating layer coveringthe third metal layer; an alignment layer arranged on the thirdinsulating layer, the alignment layer contacting to the liquid crystallayer; and a display region where a plurality of pixels are formed, oneof plurality of pixels is defined by two of the plurality of scanningsignal lines and two of the plurality of video signal lines, wherein atleast one recessed groove is formed in the third insulating layer and islocated at a region between the display region and the annular seal,wherein the recessed groove is formed on the groove bottom memberlocated above the second insulating layer, and wherein a firsttransparent conductive film is disposed between the groove bottom memberand the second insulating layer.
 10. The liquid crystal display deviceaccording to claim 9, the groove bottom member is made of a metal. 11.The liquid crystal display device according to claim 10, the groovebottom member is a part of the third metal layer.
 12. The liquid crystaldisplay device according to claim 9, the first transparent conductivefilm is in the same layer as a common electrode.
 13. The liquid crystaldisplay device according to claim 9, the at least one recessed groove iscovered by a second transparent conductive film.
 14. The liquid crystaldisplay device according to claim 13, the second transparent conductivefilm is in the same layer as a pixel electrode.